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LED substrate back side grinding wheel manufacturer

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  • Tag:LED substrate back side grinding wheel manufacturer
  • Supplier - Homray Material Technology Co., Ltd
  • China (Mainland)China (Mainland)
  • 51 - 100 People
  • Manufacturer
  • North America,South America,Eastern Europe,Southeast Asia,Oceania,Mid East,Eastern Asia,Western Europe
  • Ms.Chang
  • 86-512-67084276
Post Date : February 10
Product Details
Company Profile
Inquiry Records(3)

Item specifics


Homray Material Technology can provide various diamond back side grinding wheels for grinding machine with many brands. They are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by in-house facility, which ensures excellent grinding performance and lost cost for our customers in the world.

Our consumable parts range includes diamond grinding wheel, diamond edge grinding wheel, diamond wire, guide roller, main roller, roller coating, roller re-grooving, supply spool pulley, wire pulley, wire, epoxy resin lapping carrier, reinforced fiberglass lapping carrier, blue steel lapping carrier, cast iron dressing plate, double side washing brush, boron carbide power, boron carbide slurry pump, automatic magnetic stirrer, wax ceramic block/ ceramic bonding plate, composite resin copper polishing plate, OFHC pure cooper polishing plate, facing bite and grooving bite, condition ring with ceramic segments etc. We always keep Homray business philosophy "customer satisfaction is always our unremitting pursuit” in our minds. Owning CE, ISO Certification & Quality Control System as our quality guarantee, we won good feedback from our customers in the world.

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resin copper polishing plate manufacturer

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Homray Material Technology can provide the different material polishing plate for Diamond Polishing Machine, normally there’re two materials with OFHC pure copper polishing plate and composite resin copper polishing plate. The harder polishing plate is good for the more coarse slurry particles and the different distribution will show different effects. Composite resin copper polishing plate surface shows lower heat generation with the combination of other special materials and the variation by temperature can be minimized as well. This surface plate is good for the hard materials, especially it has the optimized cutting performance and roughness for the sapphire wafers.

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sapphire wafer copper polishing plate

sapphire wafer copper polishing plate

sapphire wafer copper polishing plate

Homray Material Technology provides the conditioning ring with ceramic segments. Diamond slurry should be uniformly distrusted on the grooves of pure cooper plate when diamond lapping process is conducted using diamond slurries on soft plate. We provide no contamination and high efficiency dressing rings of Al2O3 materials. We secure the corresponding and optimized rings to their ceramic plates and different shape for the special purpose is available as well.

Conditioning ring with ceramic segments

- Precise shape control for ceramic segments

- No contamination and high effective dressing

- Application for Diamond Polishing Machine-

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