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manufacturer of edge grinding wheel for sapphire substrate

  • Supplier - Homray Material Technology Co., Ltd
  • China (Mainland)China (Mainland)
  • 51 - 100 People
  • Manufacturer
  • North America,South America,Eastern Europe,Southeast Asia,Oceania,Mid East,Eastern Asia,Western Europe
  • Ms.Chang
  • 86-512-67084276
Post Date : August 21
Product Details
Company Profile

Item specifics

Specifications

As the edge grinding diamond wheel manufacturer, Homray Material Technology can provide two types edge grinding diamond wheel for sapphire wafer or silicon wafer chamfering. One type is metal bonding type, the other is electroplating type. Our edge grinding wheel with the accurate edge control, also Homray Material edge grinding diamond wheel can optimize the wafer edge surface finish, it can reduce or eliminate the wafer edge chipping.


Homray as the leading manufacturer and supplier of good quality diamond cutting wire, double side lapping carrier, epoxy resin working carrier, blue steel lapping carrier and ceramic block for wafer bonding, resin copper polishing plate, casting iron lapping plate ,diamond edge grinding wheel, back side grinding wheel and ceramic conditioning ring etc. Our diamond cutting wire, resin lapping carrier and other consumables are widely used in various Multi Wire Saw Machine, Double Side Lapping Machine, DMP Machine (Cu Polishing Machine) for LED sapphire substrate wafer polishing, lapping process and LED EPI wafer thinning process.

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cast iron lapping plate for double side lapping machine

cast iron lapping plate for double side lapping machine

cast iron lapping plate for double side lapping machine
Homray as the leading manufacturer and supplier of good quality diamond cutting wire, double side lapping carrier, epoxy resin working carrier, blue steel lapping carrier and ceramic block for wafer bonding, resin copper polishing plate, casting iron lapping plate ,diamond edge grinding wheel, back side grinding wheel and ceramic conditioning ring etc. Our diamond cutting wire, resin lapping carrier and other consumables are widely used in various Multi Wire Saw Machine, Double Side Lapping Machine, DMP Machine (Cu Polishing Machine) for LED sapphire substrate wafer polishing, lapping process and LED EPI wafer thinning process.
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Diamond cutting wire manufacture for sapphire

Diamond cutting wire manufacture for sapphire

Diamond cutting wire manufacture for sapphire

As the manufacturer and supplier of Diamond cutting wire. Homray Material Technology can provide multi wire saw diamond wire, Sapphire wafer slicing diamond wire.

Diamond Cutting Wire

Excellent tension control and yield strength

50% faster than conventional cutting process

High precision and good surface performance

Precise control for wire diameter, uniform wire shape

Homray as the leading manufacturer and supplier of good quality diamond cutting wire, double side lapping carrier, epoxy resin working carrier, blue steel lapping carrier and ceramic block for wafer bonding, resin copper polishing plate, ductile cast iron lapping plate ,diamond edge grinding wheel, back side grinding wheel and ceramic conditioning ring etc. Our diamond cutting wire, resin lapping carrier and other consumables are widely used in various Multi Wire Saw Machine, Double Side Lapping Machine, DMP Machine (Cu Polishing Machine) for LED sapphire substrate wafer polishing, lapping process and LED EPI wafer thinning process.

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