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desk reflow oven SR300C

  • Supplier - Beijing Torch S&T Co., Ltd.
  • China (Mainland)China (Mainland)
  • US$5 Million - US$10 Million
  • Manufacturers
  • North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
  • Mr.Richard
  • 86-10-51669522
Post Date : May 03
Product Details
Company Profile

Item specifics

Beijing China (Mainland)
0-320 degree
10 Set/Sets per Month


desk reflow oven SR300C, it is economical small lead free reflow oven. it is used in SMT industry.

A. long life and smooth capability
B. Energy-saving with high efficiency. A machine with several uses. It can be used to solidity SMT-Adhesive.
C.Components with anti-high temperature inside the machine.
D. It is quickly for cooling. And also up and down of the temperature is rapid.
E. High precision and muti-function. It satisfies the welding requirements of 0201 resistance and capacitance, small spacing QFP,SOP,PLCC,BGA,CSO and so on.
F. It is easy to operation that the controller is designed on the right. At the same time it doesn’t effect the controller that using it for a long time.
Company Related ProductsView the Seller's Products
reflow oven T200N

reflow oven T200N

reflow oven T200N

N2 device, lead free soldering, desk reflow oven, english software

T200N introduce

T200A is manufactured by Torch in 2001, which is the first desk lead free reflow oven.

As an epoch-making product, T200C break instrument controlling market in 2005.

T200N is the first nitrogen reflow oven in domestic in 2006. It entered the Texas instrument of United States, University of Texas in United States, Status Pro Corporation in Germany, LOGICOM company in Singapore, Flextronics Technology (Shanghai), Datang Microelectronics Technology Co., Ltd, Tianjin University, Shanghai Jiao Tong University, Beijing University of Technology, Zhenhua semiconductor companies and other well-known research laboratories and factories. and other well-known enterprises and laboratories.

T200N Features

1 With heater installation technology which is patent in desk reflow oven, the temperature is more uniformity which is less than 10°C, it is the highest standard.

2 With air cycle and vent technology which is patent in desk reflow oven, it improve temperature uniformity and air cycle effect.

3With door drive device which is patent in desk reflow oven to make sure worktable stable when PCB is out, and at the same time it can make chips don’t move.

4 With save nitrogen technology. When door is open, nitrogen will close automatically, when door is close, nitrogen will open automatically. It can save nitrogen and reduce cost effectively.

5 With vent smoke function. It is convenient to emitting exhaust gas.

6 With purifying and filtering exhaust gas function

7 With automatic door device. When finishing welding, door will open. With airproof technology, it can improve heat preservation effect and save nitrogen.

8 The software of T200N is designed by Torch. There are English and Chinese version. It is with program, test, save, print and other functions.

T200N technology parameters

2.1 Temperature control segment 40 segment

The temperature and lasting time of every segment can be set according to the actual requirement.

2.2 Temperature-zone numbers Single-zone and multi-segment

2.3 Temperature control system: PC control system , SSR non-contact output

2.4 Temperature accuracy ± 2 °C

2.5 Warm-up time3min

2.6 Temperature range Room-temperature -300 °C

2.7 Heating supply Infrared ray + Hot air convection

2.8 Effective working table area 270mm*230mm

2.9 Welding time 3min ± 1min

2.10 Temperature curve It can be set, adjusted and tested according to the actual requirement.

2.11 Cooling system Transverse flow and equal cooling

2.12 Rated voltage AC single-phase, 220V; 50Hz

2.13 Rated power 3.7KW Mean power 1.5kw

2.14 Weight: 65kg

2.15 Dimension length*width*Height: 680*530*380mm

Detail more >>
reflow oven T100C

reflow oven T100C

reflow oven T100C

desk reflow oven T100C, it is used in SMT production, which is lead free solder.

T100C technology parameters

2.1 Temperature control segment At most 40 segments. Set the segments from 20 to 40 according to actual requirements in the soldering machine.

2.2Temperature-zone number: Single-zone and multi-segment control, the number of control section is the highest; it can attain 40 temperature sections.

2.3 Temperature control system: Microcomputer controls automatically the temperature. SSR non-contact output. It adopts industrial computer to control the temperature and the instrument.

2.4 Temperature accuracy: ±2°C

2.5 Heating time: 2min

2.6Temperature area: room temperature--320 °C

2.7 Heating source: infrared ray+ hot-air convection

2.8 Effective worktable area: 330mm*230mm

2.9 Soldering time: 3min±1min

2.10 Temperature profile: More temperature profile can be set in the soldering machine according to the requirements. The temperature profile of 40 sections can be set to meet the requirements of different products. And can be saved in the computer which is convenient to be used again.

2.11 Temperature profile measure: It can use industrial computer to tail after temperature profile of each section and build chart automatically. It is convenient for users to analyze.

2.12 Cooling system: quick cross flow cooling system

2.13 rated power: 3.8 KW Average powers: 1.6kw

2.14 Weight: about 40kg

Detail more >>
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